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Amna Elhawil, Johan Stiens, Cathleen De Tandt, Willy Ranson, Roger Vounckx
 

Chapter in Book/ Report/ Conference proceeding

Abstract 

In this paper, we investigate a novel fast and reliable method to check the bonding quality of silicon wafers. It is based on illuminating the wafers with a high frequency waves (110 - 170 GHz) using quasi-optical technique. The reflected energy is used to evaluate the bonding strength. The reported experimental study is compared with the Infrared images.

Reference