Publication Details
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Nadine Collaert, K. Von Arnim, R. Rooyackers, T. Vandeweyer, A. Mercha, Bertrand Parvais, L. Witters, A. Nackaerts, E. Altamirano Sanchez, M. Demand, A. Hikavyy, S. Demuynck, K. Devriendt, F. Bauer, I. Ferain, A. Veloso, K. De Meyer, S. Biesemans, M. Jurczak
 

Chapter in Book/ Report/ Conference proceeding

Abstract 

Planar bulk devices suffer from high random dopant fluctuations (RDF) when scaled down to sub-32 nm technology nodes. This is considered as a major roadblock for the integration of these devices in high density 6T SRAM cells [1, 2]. The increasing variation of transistor parameters like VT, ION, IOFF, etc., can result in a large variability in performance and power. The possibility of leaving the channels undoped and their excellent immunity against Short Channel Effects (SCE) favors the use of FinFET-based multi-gate devices [3] for these technology nodes.

Reference 
 
 
DOI  scopus