Devisch, F., Maillard, X., Pan, W., De Tandt, C., Vounckx, R., & Kuijk, M. (2002). Half-conductive coupling interconnection technology for digital transmission between CMOS chips. IEEE Transactions on Advanced Packaging, (1), 97.

@article{3077bbbaa4d74469b33a46c17a05a959,
title = "Half-conductive coupling interconnection technology for digital transmission between CMOS chips",
abstract = "This paper describes how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chip standard CMOS integrated circuits. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Measurements of a complete HC-coupling, digital communication link show reliable operation up to 100 Mb/s channel speed. The two flipped prototype CMOS chips were fabricated in 0.8-mum, 5-V CMOS. The I/O pads' pitch was 150 mum",
keywords = "digital transmission, flip-chip technology, half-conductive coupling, interconnection",
author = "Frederic Devisch and Xavier Maillard and Wei Pan and {De Tandt}, Cathleen and Roger Vounckx and Maarten Kuijk",
note = "IEEE Transactions on Advanced Packaging, Vol. 25, Nr. 1, pp. 92-97.",
year = "2002",
month = feb,
day = "1",
language = "English",
pages = "97",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",
}