Pan, W., Devisch, F., De Tandt, C., Vounckx, R., & Kuijk, M. (2000). Half-conductive coupling interconnection technology for digital transmission between CMOS chips. In Proceedings of the International Interconnect Technology Conference (pp. 228-230). IEEE, 345 E 47TH ST, NEW YORK.

@inbook{7bcdaff24a3043cda04380d0901b14cc,
title = "Half-conductive coupling interconnection technology for digital transmission between CMOS chips",
abstract = "This paper describes for the first time how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chipped standard CMOS chips. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any pest-processing steps. Due to shielding effects, the technology promises ultra-high-density interconnections",
keywords = "interconnects, half-conductive",
author = "Wei Pan and Frederic Devisch and {De Tandt}, Cathleen and Roger Vounckx and Maarten Kuijk",
note = "Proceedings of the International Interconnect Technology Conference, ISBN: 0-7803-6327-2 by IEEE press, pp 228- 230, pp. 228-230.",
year = "2000",
month = jun,
day = "5",
language = "English",
isbn = "0-7803-6327-2",
pages = "228--230",
booktitle = "Proceedings of the International Interconnect Technology Conference",
publisher = "IEEE, 345 E 47TH ST, NEW YORK",
}