In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.
Collaert, N, Alian, A, Banerjee, A, Chauhan, V, Elkashlan, RY, Hsu, B, Ingels, M, Khaled, A, Vondkar Kodandarama, K, Kunert, B, Mols, Y, Peralagu, U, Putcha, V, Rodriguez, R, Sibaja-Hernandez, A, Simoen, E, Vais, A, Walke, A, Witters, L, Yadav, S, Yu, H, Zhao, M, Wambacq, P, Parvais, B & Waldron, N 2020, From 5G to 6G: Will compound semiconductors make the difference? in S Yu, X Zhu & T-A Tang (eds), 2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings., 9278253, 2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020, Virtual, Kunming, China, 3/11/20. https://doi.org/10.1109/ICSICT49897.2020.9278253
Collaert, N., Alian, A., Banerjee, A., Chauhan, V., Elkashlan, R. Y., Hsu, B., Ingels, M., Khaled, A., Vondkar Kodandarama, K., Kunert, B., Mols, Y., Peralagu, U., Putcha, V., Rodriguez, R., Sibaja-Hernandez, A., Simoen, E., Vais, A., Walke, A., Witters, L., ... Waldron, N. (2020). From 5G to 6G: Will compound semiconductors make the difference? In S. Yu, X. Zhu, & T.-A. Tang (Eds.), 2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings Article 9278253 (2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSICT49897.2020.9278253
@inproceedings{0a3309e02cfe494e9cbe87897aaacc0e,
title = "From 5G to 6G: Will compound semiconductors make the difference?",
abstract = "In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.",
author = "N. Collaert and A. Alian and A. Banerjee and V. Chauhan and Elkashlan, {R. Y.} and B. Hsu and M. Ingels and A. Khaled and {Vondkar Kodandarama}, K. and B. Kunert and Y. Mols and U. Peralagu and V. Putcha and R. Rodriguez and A. Sibaja-Hernandez and E. Simoen and A. Vais and A. Walke and L. Witters and S. Yadav and H. Yu and M. Zhao and P. Wambacq and B. Parvais and N. Waldron",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.; 15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 ; Conference date: 03-11-2020 Through 06-11-2020",
year = "2020",
month = nov,
day = "3",
doi = "10.1109/ICSICT49897.2020.9278253",
language = "English",
series = "2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Shaofeng Yu and Xiaona Zhu and Ting-Ao Tang",
booktitle = "2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings",
address = "United States",
}