Publication Details
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Pierre Boulenc, Jo Robbelein, Linkun Wu, Luc Haspeslagh, Piet De Moor, Jonathan Borremans, Maarten Rosmeulen
 

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Abstract 

This paper reports on a Time Delay and Integration image sensor System-on-Chip realized in an embedded CCD process. The integration of single-poly CCD modules into a standard 0.13µm CMOS process is discussed. The technology performance has been evaluated using dedicated test structures. Next, a prototype TDI imager with 5µm pixel pitch, 512 rows and 1024 columns was designed, manufactured and characterized. Charge Transfer Efficiency greater than 0.9999 up till very high line rates of 400kHz was recorded.

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