Pan, W., De Tandt, C., Devisch, F., Vounckx, R., & Kuijk, M. (1999). Half-conductive Coupling for Chip-to-Chip Connections. In IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP (pp. 32). IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP, Vol. 1, pp. 29-32, San Diego, USA..

@inproceedings{54ec3e2a97454f3787ea9924006bcf11,
title = "Half-conductive Coupling for Chip-to-Chip Connections",
author = "Wei Pan and \{De Tandt\}, Cathleen and Frederic Devisch and Roger Vounckx and Maarten Kuijk",
note = "IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP, Vol. 1, pp. 29-32, San Diego, USA.; Unknown ; Conference date: 01-01-1999",
year = "1999",
language = "English",
pages = "32",
booktitle = "IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP",
publisher = "IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP, Vol. 1, pp. 29-32, San Diego, USA.",
}