Pan, W., Devisch, F., De Tandt, C., Vounckx, R., & Kuijk, M. (2000). Half-conductive Coupling for Flip Chip Interconnections. In IEEE International Workshop on Chip-Package Co-Design, CPD 2000 IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Zürich, Zürich, Switzerland..

@inproceedings{087d765007c14e7fa685552176d8a4e2,
title = "Half-conductive Coupling for Flip Chip Interconnections",
author = "Wei Pan and Frederic Devisch and \{De Tandt\}, Cathleen and Roger Vounckx and Maarten Kuijk",
note = "IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Z{\"u}rich, Z{\"u}rich, Switzerland.; Unknown ; Conference date: 01-01-2000",
year = "2000",
language = "English",
booktitle = "IEEE International Workshop on Chip-Package Co-Design, CPD 2000",
publisher = "IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Z{\"u}rich, Z{\"u}rich, Switzerland.",
}