Pieter Cardinael, Pieter Cardinael, Sachin Yadav, Sachin Yadav, Herwig Hahn, Herwig Hahn, Ming Zhao, Ming Zhao, Sourish Banerjee, Sourish Banerjee, Babak Kazemi Esfeh, Babak Kazemi Esfeh, Christof Mauder, Christof Mauder, Barry O Sullivan, Barry O Sullivan, Uthayasankaran Peralagu, Uthayasankaran Peralagu, Anurag Vohra, Anurag Vohra, Robert Langer, Robert Langer,
Nadine Collaert,
Nadine Collaert,
Bertrand Parvais,
Bertrand Parvais, Jean-Pierre Raskin, Jean-Pierre Raskin
Fabrication of low-RF loss GaN-on-Si HEMT stacks is critical to enable competitive front-end-modules for 5G and 6G applications. The main contribution to RF losses is the interface between the III-N layer and the HR Si wafer, more specifically the AlN/Si interface. At this interface, a parasitic surface conduction layer exists in Si, which decreases the substrate effective resistivity sensed by overlying circuitry below the nominal Si resistivity. However, a clear understanding of this interface with control of the parasitic channel is lacking. In this letter, a detailed physical and electrical description of MOCVD-grown AlN/Si structures is presented. The presence of a \$\textbackslash{}text\{SiC\}\_\textbackslash{}text\{x\}\textbackslash{}text\{N\}\_\textbackslash{}text\{y\}\$ interfacial layer is revealed and its importance for RF losses is shown. Through C-V and I-V characterisation, an increase in the C concentration of this interfacial layer is linked to the formation of negative charge at the AlN/Si interface, which counteracts the positive charge present in the 0-predose limit. The variation of TMAl predose is shown to allow precise tuning of the C composition and, consequently, the resulting interface charge. Notably, a linear relationship between predose and net interface charge is observed and confirmed by the fabrication of an AlN/Si sample with close to zero net charge. In addition, a higher \$D\_\{it\}\$ (\$\textbackslash{}sim 2\textbackslash{}times 10\textasciicircum{}\{12\}\$ cm\$\textasciicircum{}\textbackslash{}text\{-2\}\$) for such compensated samples is observed and can contribute to low RF loss. An exceptionally high effective resistivity of above 8 k\$\textbackslash{}Omega\textbackslash{}cdot\$cm is achieved, corresponding to an RF loss below 0.3 dB/mm at 10 GHz.
Cardinael, P, Yadav, S, Hahn, H, Zhao, M, Banerjee, S, Esfeh, BK, Mauder, C, Sullivan, BO, Peralagu, U, Vohra, A, Langer, R, Collaert, N, Parvais, B & Raskin, J-P 2024 'AlN/Si interface engineering to mitigate RF losses in MOCVD grown GaN-on-Si substrates' ArXiv. https://doi.org/10.48550/arXiv.2404.02707
Cardinael, P., Yadav, S., Hahn, H., Zhao, M., Banerjee, S., Esfeh, B. K., Mauder, C., Sullivan, B. O., Peralagu, U., Vohra, A., Langer, R., Collaert, N., Parvais, B., & Raskin, J.-P. (2024). AlN/Si interface engineering to mitigate RF losses in MOCVD grown GaN-on-Si substrates. ArXiv. https://doi.org/10.48550/arXiv.2404.02707
@techreport{c5822bf42bca4a268c0f76fb33ccda2f,
title = "AlN/Si interface engineering to mitigate RF losses in MOCVD grown GaN-on-Si substrates",
abstract = " Fabrication of low-RF loss GaN-on-Si HEMT stacks is critical to enable competitive front-end-modules for 5G and 6G applications. The main contribution to RF losses is the interface between the III-N layer and the HR Si wafer, more specifically the AlN/Si interface. At this interface, a parasitic surface conduction layer exists in Si, which decreases the substrate effective resistivity sensed by overlying circuitry below the nominal Si resistivity. However, a clear understanding of this interface with control of the parasitic channel is lacking. In this letter, a detailed physical and electrical description of MOCVD-grown AlN/Si structures is presented. The presence of a \$\textbackslash{}text\{SiC\}\_\textbackslash{}text\{x\}\textbackslash{}text\{N\}\_\textbackslash{}text\{y\}\$ interfacial layer is revealed and its importance for RF losses is shown. Through C-V and I-V characterisation, an increase in the C concentration of this interfacial layer is linked to the formation of negative charge at the AlN/Si interface, which counteracts the positive charge present in the 0-predose limit. The variation of TMAl predose is shown to allow precise tuning of the C composition and, consequently, the resulting interface charge. Notably, a linear relationship between predose and net interface charge is observed and confirmed by the fabrication of an AlN/Si sample with close to zero net charge. In addition, a higher \$D\_\{it\}\$ (\$\textbackslash{}sim 2\textbackslash{}times 10\textasciicircum{}\{12\}\$ cm\$\textasciicircum{}\textbackslash{}text\{-2\}\$) for such compensated samples is observed and can contribute to low RF loss. An exceptionally high effective resistivity of above 8 k\$\textbackslash{}Omega\textbackslash{}cdot\$cm is achieved, corresponding to an RF loss below 0.3 dB/mm at 10 GHz. ",
keywords = "physics.app-ph",
author = "Pieter Cardinael and Sachin Yadav and Herwig Hahn and Ming Zhao and Sourish Banerjee and Esfeh, \{Babak Kazemi\} and Christof Mauder and Sullivan, \{Barry O\} and Uthayasankaran Peralagu and Anurag Vohra and Robert Langer and Nadine Collaert and Bertrand Parvais and Jean-Pierre Raskin",
note = "The following article has been accepted for publication in Applied Physics Letters. After it is published, it will be found at https://pubs.aip.org/aip/apl",
year = "2024",
month = apr,
day = "3",
doi = "10.48550/arXiv.2404.02707",
language = "English",
publisher = "ArXiv",
type = "WorkingPaper",
institution = "ArXiv",
}