Publication Details
Overview
 
 
Rana Yasser ElKashlan, Ahmad Khaled, Raul Rodriguez, Sachin Yadav, Uthayasankaran Peralagu, Alireza Alian, Nadine Collaert, Piet Wambacq, Bertrand Parvais
 

Chapter in Book/ Report/ Conference proceeding

Abstract 

We examine the influence of scaling the GaN channel thickness from 100nm to 35nm on the RF performance for GaN HEMTs on Si with a cGaN back-barrier with gate lengths ranging from 70nm to 190nm. Thinner GaN channels notably improve the short channel effects. However, there is a degradation in the on-state performance associated with an increase in dispersion. These trade-offs translate to a \textasciitilde{}33\%, \textasciitilde{}20\% decline in fT,fMAX respectively, for 70nm devices. While the large-signal metrics, PSAT and PAE, at 6GHz drop by \textasciitilde{}46\% and \textasciitilde{}18\%, respectively. We also consider the lateral downscaling of the gate-to-drain and gate-to-source spacings, which proves beneficial in boosting PSAT, up to 3.4W/mm, by increasing the extrinsic transconductance by \textasciitilde{}20\%.

Reference