Publication Details
Overview
 
 
Hao Yu, Hao Yu, Marc Schaekers, Marc Schaekers, Jean Luc Everaert, Jean Luc Everaert, Naoto Horiguchi, Naoto Horiguchi, Kristin De Meyer, Kristin De Meyer, Nadine Collaert, Nadine Collaert
 

Contribution to journal

Abstract ■

Contact resistances take a significant portion of on-state resistances of advanced Si CMOS transistors. As a result, a metal–semiconductor contact resistivity (ρc) of sub-10–8 Ω cm2 or even sub-10–9 Ω·cm2 is required to achieve high performance for a very downscaled transistor. In this snapshot review on our ρc investigation efforts, we first introduce a test structure—a multiring circular transmission line model (MR-CTLM)—with high accuracy to measure ultralow ρc, and then we evaluate different contact solutions. Our contact solution exploration includes metal/insulator/semiconductor (MIS) contacts for n+-Si and advanced (gemano-)silicides for n+-Si and p+-SiGe. We will discuss limitations of MIS contacts. And we will demonstrate encouraging ρc of 10–9 Ω cm2 that meet the requirement of 7-nm or 5-nm CMOS technology nodes. Graphical abstract: [Figure not available: see fulltext.].

Reference ■