Publication Details
Overview
 
 
Nadine Collaert, Nadine Collaert, A. Alian, A. Alian, A. Banerjee, A. Banerjee, V. Chauhan, V. Chauhan, Rana Yasser ElKashlan, Rana Yasser ElKashlan, B. Hsu, B. Hsu, M. Ingels, M. Ingels, A. Khaled, A. Khaled, K. Vondkar Kodandarama, K. Vondkar Kodandarama, B. Kunert, B. Kunert, Y. Mols, Y. Mols, U. Peralagu, U. Peralagu, V. Putcha, V. Putcha, R. Rodriguez, R. Rodriguez, A. Sibaja-Hernandez, A. Sibaja-Hernandez, E. Simoen, E. Simoen, A. Vais, A. Vais, A. Walke, A. Walke, L. Witters, L. Witters, S. Yadav, S. Yadav, H. Yu, H. Yu, M. Zhao, M. Zhao, Piet Wambacq, Piet Wambacq, Bertrand Parvais, Bertrand Parvais, N. Waldron, N. Waldron
 

Chapter in Book/ Report/ Conference proceeding

Abstract ■

In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.

Reference ■