Publication Details
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Neha Sharan, Neha Sharan, Geert Eneman, Geert Eneman, Nadine Collaert, Nadine Collaert, Bertrand Parvais, Bertrand Parvais, Alessio Spessot, Alessio Spessot, Anda Mocuta, Anda Mocuta, Khaja A. Shaik, Khaja A. Shaik, Doyoung Jang, Doyoung Jang, Pieter Schuddinck, Pieter Schuddinck, Dmitry Yakimets, Dmitry Yakimets, Marie Garcia Bardon, Marie Garcia Bardon, Jerome Mitard, Jerome Mitard, Hiroaki Arimura, Hiroaki Arimura, Fabian M. Bufler, Fabian M. Bufler
 

Contribution to journal

Abstract ■

In this article, we explore different device and standard cell architectures for scaling the Germanium fin field-effect transistor (FinFET) and nanosheet (NS) at the sub-5-nm node. It is demonstrated that the Germanium device provides approximately 70\% improvement in drive current and 3.4 × less device resistance. The main concern for Germanium devices remains the high leakage current due to the gate-induced drain leakage, which limits their usage to high-speed applications. Overall, Germanium devices require fewer boosters than silicon to scale beyond the 5-nm node. Contact resistivity is found to be a critical knob for Germanium and it can be relaxed to 3e-9 Ω-cm 2 to meet the power and performance targets for the sub-5-nm node. Moving to the NS helps in relaxing this constraint further.

Reference ■