Publication Details
Overview
 
 
Pierre Boulenc, Pierre Boulenc, Jo Robbelein, Jo Robbelein, Linkun Wu, Linkun Wu, Luc Haspeslagh, Luc Haspeslagh, Piet De Moor, Piet De Moor, Jonathan Borremans, Jonathan Borremans, Maarten Rosmeulen, Maarten Rosmeulen
 

Chapter in Book/ Report/ Conference proceeding

Abstract ■

This paper reports on a Time Delay and Integration image sensor System-on-Chip realized in an embedded CCD process. The integration of single-poly CCD modules into a standard 0.13µm CMOS process is discussed. The technology performance has been evaluated using dedicated test structures. Next, a prototype TDI imager with 5µm pixel pitch, 512 rows and 1024 columns was designed, manufactured and characterized. Charge Transfer Efficiency greater than 0.9999 up till very high line rates of 400kHz was recorded.

Reference ■