Characterisation of Silicon Wafer Bonding Quality using Mm-wave Quasi-Optical technique
 
Characterisation of Silicon Wafer Bonding Quality using Mm-wave Quasi-Optical technique ■
 
Amna Elhawil, Johan Stiens, Cathleen De Tandt, Willy Ranson, Roger Vounckx
 
Abstract ■

In this paper, we investigate a novel fast and reliable method to check the bonding quality of silicon wafers. It is based on illuminating the wafers with a high frequency waves (110 - 170 GHz) using quasi-optical technique. The reflected energy is used to evaluate the bonding strength. The reported experimental study is compared with the Infrared images.