Wafer-bonded thin-film surface-roughened light emitting diodes
 
Wafer-bonded thin-film surface-roughened light emitting diodes 
 
Cathleen Rooman, Stijn De Jonge, C. Karnutsch, K. Streubel, Maarten Kuijk, Barun Dutta, Gustaaf Borghs, P. Heremans
 
Abstract 

We propose a new process for thin-film surface-textured LEDs that provides uniform current injection for both top and bottom contacts. The structure uses a partially conductive mirror. This eliminates the need for thick epitaxial layers and makes it possible to fabricate very large LEDs. Furthermore, the new process allows to obtain both high external quantum efficiency and high wallplug efficiency