Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors

Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors ■

Cathleen Rooman, Maarten Kuijk, Reiner Windisch, Roger Vounckx, Gustaaf Borghs, Armin Plichta, M. Brinkmann, K. Gerstner, R. Strack, P. Van Daele, W. Woittiez, Roel Baets, P. Heremans

Abstract ■

We present a norel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively Each channel takes an area of merely, 100 mum x 100mum