Increasing the Functionality of Free-Space Micro-Optical Intra-Chip Modules with DOEs: towards Reconfigurable Photonic Interconnects ■
Lieven Desmet, Lieven Desmet, Lieven Desmet, A. Sagan, A. Sagan, A. Sagan, W. Grabowski, W. Grabowski, W. Grabowski, Ryszard Buczynski, Ryszard Buczynski, Ryszard Buczynski, Hugo Thienpont, Hugo Thienpont, Hugo Thienpont