Reliability Characterization of Thermal Micro-structures Implemented on 0.8 µm CMOS Chips ■
Lieyi Sheng, Lieyi Sheng, Lieyi Sheng, Cathleen De Tandt, Cathleen De Tandt, Cathleen De Tandt, Willy Ranson, Willy Ranson, Willy Ranson,
Roger Vounckx,
Roger Vounckx,
Roger Vounckx