Thin-Film Multi-Chip Module Technology on High-Resistivity Si For the Integration of Millimeter Wave Systems ■
Guillermo Posada Quijana, Guillermo Posada Quijana, Geert Carchon, Geert Carchon, Gert Poesen, Gert Poesen, B. Nauwelaers, B. Nauwelaers, Walter De Raedt, Walter De Raedt