Characterisation of Silicon Wafer Bonding Quality using Mm-wave Quasi-Optical technique
 
Characterisation of Silicon Wafer Bonding Quality using Mm-wave Quasi-Optical technique ■
 
Amna Elhawil, Amna Elhawil, Amna Elhawil, Johan Stiens, Johan Stiens, Johan Stiens, Cathleen De Tandt, Cathleen De Tandt, Cathleen De Tandt, Willy Ranson, Willy Ranson, Willy Ranson, Roger Vounckx, Roger Vounckx, Roger Vounckx
 
Abstract ■

In this paper, we investigate a novel fast and reliable method to check the bonding quality of silicon wafers. It is based on illuminating the wafers with a high frequency waves (110 - 170 GHz) using quasi-optical technique. The reflected energy is used to evaluate the bonding strength. The reported experimental study is compared with the Infrared images.