Half-conductive coupling interconnection technology for digital transmission between CMOS chips
 
Half-conductive coupling interconnection technology for digital transmission between CMOS chips ■
 
Wei Pan, Wei Pan, Wei Pan, Frederic Devisch, Frederic Devisch, Frederic Devisch, Cathleen De Tandt, Cathleen De Tandt, Cathleen De Tandt, Roger Vounckx, Roger Vounckx, Roger Vounckx, Maarten Kuijk, Maarten Kuijk, Maarten Kuijk
 
Abstract ■

This paper describes for the first time how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chipped standard CMOS chips. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any pest-processing steps. Due to shielding effects, the technology promises ultra-high-density interconnections