Wafer-bonded thin-film surface-roughened light emitting diodes ■
Cathleen Rooman, Cathleen Rooman, Cathleen Rooman, Stijn De Jonge, Stijn De Jonge, Stijn De Jonge, C. Karnutsch, C. Karnutsch, C. Karnutsch, K. Streubel, K. Streubel, K. Streubel,
Maarten Kuijk,
Maarten Kuijk,
Maarten Kuijk, Barun Dutta, Barun Dutta, Barun Dutta, Gustaaf Borghs, Gustaaf Borghs, Gustaaf Borghs, P. Heremans, P. Heremans, P. Heremans
We propose a new process for thin-film surface-textured LEDs that provides uniform current injection for both top and bottom contacts. The structure uses a partially conductive mirror. This eliminates the need for thick epitaxial layers and makes it possible to fabricate very large LEDs. Furthermore, the new process allows to obtain both high external quantum efficiency and high wallplug efficiency