Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors

Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors ■

Cathleen Rooman, Cathleen Rooman, Cathleen Rooman, Maarten Kuijk, Maarten Kuijk, Maarten Kuijk, Reiner Windisch, Reiner Windisch, Reiner Windisch, Roger Vounckx, Roger Vounckx, Roger Vounckx, Gustaaf Borghs, Gustaaf Borghs, Gustaaf Borghs, Armin Plichta, Armin Plichta, Armin Plichta, M. Brinkmann, M. Brinkmann, M. Brinkmann, K. Gerstner, K. Gerstner, K. Gerstner, R. Strack, R. Strack, R. Strack, P. Van Daele, P. Van Daele, P. Van Daele, W. Woittiez, W. Woittiez, W. Woittiez, Roel Baets, Roel Baets, Roel Baets, P. Heremans, P. Heremans, P. Heremans

Abstract ■

We present a norel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively Each channel takes an area of merely, 100 mum x 100mum