In this project we want to find solutions to the difficulties of electronic interconnects to handle high thoughput data transfer within and between silicon VSLI chips. The project will demonstrate the advantages of high-throughput optical chip-to-chip interconnects by integrating area optical interconnections with standard (i.e. foundry based) CMOS chips, also adressing cost effectiveness as well as manufacturability. Processor architectures where the area optical interconnects offer substantial benefits will be identified. A CMOS VLSI chip will be designed, implementing at least partly such an architecture, and equipd with integrated analog driver and receiver circuitry to interface the digital processing module to the optoelectronic components. Source arrays (VCSEL and LED arrays) anddetector arrays will be developed in the project, as well as the micro-optical hardware assuring the intra-MCM or inter-MCM link. Because of the requirement for an area interconnect, these optoelectronis components will be directly mounted on the silicon CMOS chip. This micro-optical hardware will consist of novel Optical Pathway Blocks (OPB's) based on polymer technology

Runtime: 1996 - 2001