Rooman, C., Kuijk, M., Windisch, R., Vounckx, R., Borghs, G., Plichta, A., Brinkmann, M., Gerstner, K., Strack, R., Van Daele, P., Woittiez, W., Baets, R., & Heremans, P. (2001). Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors. In Proc. 27th ECOC 2001 (pp. 297). IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA.

@inproceedings{6607876125f64a99aaa09a8a0fca2c34,
title = "Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors",
abstract = "We present a norel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively Each channel takes an area of merely, 100 mum x 100mum",
author = "Cathleen Rooman and Maarten Kuijk and Reiner Windisch and Roger Vounckx and Gustaaf Borghs and Armin Plichta and M. Brinkmann and K. Gerstner and R. Strack and {Van Daele}, P. and W. Woittiez and Roel Baets and P. Heremans",
note = "Proc. 27th ECOC 2001, Vol. 27, pp. 296-297.; Unknown ; Conference date: 30-09-2001",
year = "2001",
month = sep,
day = "30",
language = "English",
isbn = "0-7803-6705-7",
pages = "297",
booktitle = "Proc. 27th ECOC 2001",
publisher = "IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA",
}