Sheng, L, De Tandt, C, Ranson, W & Vounckx, R 2000, Reliability Characterization of Thermal Micro-structures Implemented on 0.8 µm CMOS Chips. in International Reliability Physics Symposium. IRPS 2000. International Reliability Physics Symposium. IRPS 2000, Vol. 38, pp. 112-117, San Jose, USA., pp. 117, Unknown, 1/01/00.
Sheng, L., De Tandt, C., Ranson, W., & Vounckx, R. (2000). Reliability Characterization of Thermal Micro-structures Implemented on 0.8 µm CMOS Chips. In International Reliability Physics Symposium. IRPS 2000 (pp. 117). International Reliability Physics Symposium. IRPS 2000, Vol. 38, pp. 112-117, San Jose, USA..
@inproceedings{38354ef30380417482f92b757aade2a7,
title = "Reliability Characterization of Thermal Micro-structures Implemented on 0.8 µm CMOS Chips",
author = "Lieyi Sheng and \{De Tandt\}, Cathleen and Willy Ranson and Roger Vounckx",
note = "International Reliability Physics Symposium. IRPS 2000, Vol. 38, pp. 112-117, San Jose, USA.; Unknown ; Conference date: 01-01-2000",
year = "2000",
language = "English",
pages = "117",
booktitle = "International Reliability Physics Symposium. IRPS 2000",
publisher = "International Reliability Physics Symposium. IRPS 2000, Vol. 38, pp. 112-117, San Jose, USA.",
}