Publication Details
Overview
 
 
Shih-Hsiang Lin, Marko Simicic, Nicolas Pantano, Shih-Hung Chen, Philippe Roussel, Geert Van Der Plas, Eric Beyne, Piet Wambacq
 

2023 45th Annual EOS/ESD Symposium (EOS/ESD)

Contribution To Book Anthology

Abstract 

Three-dimensional (3D) die-stacking has become a promising way to continue improving the integrated circuits performance. However, the risk of electrostatic discharge (ESD) during the stacking process is not yet fully understood. In this paper, we focus on understanding the electrostatics before the contact moment for the 3D stacking process. Our findings indicate that the stacking process presents a relatively low risk of ESD.

Reference 
 
 
DOI ieeexplore scopus